Advanced lithography kits: serifs and hammerhead

Hang-Yip Liu; Steffen F. Schulze; Alan C. Thomas; Anne E. McGuire; Michael Cross

doi:10.1117/12.395715

18 August 2000 Advanced lithography kits: serifs and hammerhead

Hang-Yip Liu, Steffen F. Schulze, Alan C. Thomas, Anne E. McGuire, Michael Cross

Proceedings Volume 4181, Challenges in Process Integration and Device Technology; (2000) https://doi.org/10.1117/12.395715
Event: Microelectronic Manufacturing, 2000, Santa Clara, CA, United States

Abstract

Resolution enhancement techniques and higher NA exposure are employed to meet the lithography requirements imposed by aggressive shrinks to chip feature sizes. For certain critical levels, like storage and isolation patterning of DRAM devices, the capability to exactly reproduce the mask layout is limited. Severe corner rounding and line image shortening can occur. Such phenomena can be significant contributors to side effects like current leakage, inadequate retention time, stress, and perhaps yield loss. Our development work has shown that the use of Serif and Hammerhead structures can improve resolution printing. Moreover, better process latitude and CD control can be achieved. This paper gives an overview of these innovative techniques. It includes the consideration of different design layouts based on simulations, as well as mask making limitations e.g. mask inspection capability. The benefits of these techniques are discussed and illustrated with detailed lithographic performance data and SEM pictures.

Citation Download Citation

Hang-Yip Liu, Steffen F. Schulze, Alan C. Thomas, Anne E. McGuire, and Michael Cross "Advanced lithography kits: serifs and hammerhead", Proc. SPIE 4181, Challenges in Process Integration and Device Technology, (18 August 2000); https://doi.org/10.1117/12.395715

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