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18 August 2000 Is lithography ready for 300 mm?
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Abstract
SEMICONDUCTOR300 was the first pilot production facility for 300mm wafers in the world. This company, a joint venture between Infineon Technologies Motorola, started in early 1998 to develop processes and manufacture products using 300mm wafer tool set. The lithography tools include I-line steppers, as I-line scanner, a DUV stepper, and DUV scanners. All of these exposure tools are running in-line with a photoresist coat and develop track. The lithography tools are used to build 64Mb DRAM devices and aggressive test vehicles with design rules of 0.25 micrometers and below, in sufficient quantity to be able to assess the tool readiness. This paper present the history of technical improvements and roadblocks that have occurred on the 300mm lithography tool set since the start-up, and describe a methodology used to assess the tool performance.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alain B. Charles, Clint Haris, Steffen R. Hornig, Dietmar Ganz, Thorsten Schedel, Guenther Hraschan, Wolfram Koestler, John G. Maltabes, Karl E. Mautz, Sebastian Schmidt, and Ralf Schuster "Is lithography ready for 300 mm?", Proc. SPIE 4181, Challenges in Process Integration and Device Technology, (18 August 2000); https://doi.org/10.1117/12.395736
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