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23 August 2000 Real-time yield checks at wafer test
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In this work, we describe some of the problems that can affect the yield at Wafer Probe, and at the checks performed by a software that we have developed to ensure the good quality of the wafer probing. Most of the problems at Wafer Probe appear in the same way and by detecting their pattern, even not knowing the exact source of the problem, we can prevent the product and its yield form being affected. The most common patterns of failures are: a certain category failing consecutively, a certain test failing above statistical limits expected, based on the historical results of that product, same wafers yielding different in two different testers, and results in a lot going worse wafer by wafer. For addressing these issues, we run in real time a set of programs at the end of every wafer tested. These programs generate alarms and tell actions to the operator when the above problems are detected.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Enrique Rodriguez, Carlos Cano, Javier Sanchez-Vicente, and Julian Moreno "Real-time yield checks at wafer test", Proc. SPIE 4182, Process Control and Diagnostics, (23 August 2000);

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