Paper
17 April 2001 Impact shearing deformation behavior of interfacial crack in ENF test specimen
Hideaki Ito, Tsutomu Ezumi, Susumu Takahashi, Kazuo Sato
Author Affiliations +
Proceedings Volume 4183, 24th International Congress on High-Speed Photography and Photonics; (2001) https://doi.org/10.1117/12.424261
Event: 24th International Congress on High-Speed Photography and Photonics, 2000, Sendai, Japan
Abstract
In this study, the dynamic fracture behavior of a bonded dissimilar material, which had the interfacial crack, was analyzed. The stress intensity factor of the interfacial crack was determined by using method of caustics and the simple type high-speed photography method for the analysis, and dynamic behavior of the interfacial crack, which received the shearing deformation, was observed. The test specimen shape was assumed to be ENF test specimen. The sample material made to epoxy resin and polycarbonate, and used an epoxy system adhesive for joining. As a result, the vibration characteristic was possessed in the interfacial crack as well as the crack in a homogeneous material. And, a dynamic fracture toughness of the interfacial crack reached a different value by a material and joined condition to receive the load. Moreover, the propagation behavior of the interfacial crack became a different result with receiving the load and the phase material. The interfacial crack wound to the upper phase material at the case when the upper phase material was a brittleness material, and the propagating angle of the crack was 70 degrees. The dynamic fracture behavior of the interfacial crack when the upper phase material was ductile material propagated on the interface at high speed. In addition, the time of the propagation of the crack became a result different depending on joined condition, too. When the upper phase material was brittle material, the crack propagation time became a slow result early for ductile materials. The dynamic fracture toughness value and the crack propagation time of the interfacial crack became different results by the difference of the component of the test specimen. Therefore, dynamic fracture toughness and the crack propagating behavior depended on a material and joined condition to receive the load.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hideaki Ito, Tsutomu Ezumi, Susumu Takahashi, and Kazuo Sato "Impact shearing deformation behavior of interfacial crack in ENF test specimen", Proc. SPIE 4183, 24th International Congress on High-Speed Photography and Photonics, (17 April 2001); https://doi.org/10.1117/12.424261
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KEYWORDS
Epoxies

Interfaces

Picosecond phenomena

Tin

High speed photography

Adhesives

Mechanical engineering

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