Paper
22 January 2001 Minimization of mask transmission asymmetry effect for chromeless phase-shift masks
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Abstract
One of the issues with using strong phase-shift masks is the transmission asymmetry caused by diffraction effects due to 3D mask topography. The transmission is reduced through the etched portions of the mask and this can result in CD or pitch asymmetries in the printed image. A number of approaches have been suggested to minimize this effect including feature biasing, dual trench and undercut etching. In this work, we investigate the role the resist type can play in minimizing the effects of this aerial image asymmetry. We employ full electromagnetic simulations using PROMAX 2/D and PROLITH 2/D, AIMS simulation, and experiments using chrome-less phase-shift masks as a function of resist type. We conclude that the resist type can play a key role in minimizing the effects of aerial image asymmetry caused by mask topography effects thereby enabling simpler mask fabrication approaches.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David Y. Chan, Justin W. Novak, and Michael Fritze "Minimization of mask transmission asymmetry effect for chromeless phase-shift masks", Proc. SPIE 4186, 20th Annual BACUS Symposium on Photomask Technology, (22 January 2001); https://doi.org/10.1117/12.410678
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KEYWORDS
Photomasks

Diffusion

Diffraction

Mask making

Coherence (optics)

Etching

Diffraction gratings

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