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22 January 2001 Sub-120-nm technology compatibility of attenuated phase-shift mask in KrF and ArF lithography
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This paper describes that attenuated phase shift masks (APSM) improve process margin compared to binary mask (BIM) in KrF and ArF lithography. We present the real problems to occur in the mask fabrication, process and mask error factor (MEF). As a result, sub-120nm cell patterns were delineated with 8% exposure latitude (EL) and ~0.6 ?m local depth of focus (LDOF) using 0.70NA KrF and APSM. The performance of ArF lithography (NA=0.63) shows the similar process margin with 10% EL and -0.6 ?m LDOF. Using APSM, we could obtain 14.4% EL and -0.6 ?m LDOF. We obtained process enhancement of 30% by using APSM. However, process instability is analyzed in a viewpoint of mask making and process issue such as mask fabrication capability, CD uniformity, and MEF. In simulation and experiment, 0.63NA ArF lithography shows resolution improvement compared to 0.70NA KrF. It is possible to obtain lOOnm pattern using ArF and APSM. Also, one of common issues is to reduce the MEF, which is decided by exposure and resist process condition. MEF is increased to about 4 or more in the sub-120nm range. This effect has influence on CD uniformity and EL margin. Reducing the MEF on the wafer, we have to optimize exposure tool, process, and mask. Shorter wavelength and APSM are one of candidates to minimize MEF. Therefore, ArF APSM is looking forward to high performance lithography.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Young-Mog Ham, Seo-Min Kim, Sang-Jin Kim, Sang-Man Bae, Young-Deuk Kim, and Ki-Ho Baik "Sub-120-nm technology compatibility of attenuated phase-shift mask in KrF and ArF lithography", Proc. SPIE 4186, 20th Annual BACUS Symposium on Photomask Technology, (22 January 2001); doi: 10.1117/12.410712;

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