13 October 2000 Boundary condition evaluation in nonlinear resonance and stress analysis of a printed wiring board
Author Affiliations +
Proceedings Volume 4192, Intelligent Systems in Design and Manufacturing III; (2000) https://doi.org/10.1117/12.403647
Event: Intelligent Systems and Smart Manufacturing, 2000, Boston, MA, United States
Abstract
Vibration of a printed wiring board (PWB) based on Von Karman nonlinear strain field is analyzed. Equations of motion for the simply supported PWB and the clamped PWB are obtained for nonlinear vibration analysis. A 2-layer plastic PWB made of isotropic laminates is studied for its boundary condition effect on the vibratory behavior in deflection and stress distribution. Failure due to plane stress condition is estimated based on the composite failure criteria. Results are demonstrated through numerical computation. It is found that under the same loading, deflection of the clamped PWB is lower than that of the simply supported PWB, except at the lower frequency resonance. Nonlinear resonance occurs periodically with respect to the excitation frequency for both boundary conditions. At high excitation frequency, resonance deflection is mainly affected by the loading magnitude. Under the same load magnitude, simply supported PWB has the maximum stress close to that of the clamped PWB, and with improved reliability. Resonance in conjunction with stress analysis is critical in PWB failure prediction.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xiaoling He, Xiaoling He, Robert E. Fulton, Robert E. Fulton, } "Boundary condition evaluation in nonlinear resonance and stress analysis of a printed wiring board", Proc. SPIE 4192, Intelligent Systems in Design and Manufacturing III, (13 October 2000); doi: 10.1117/12.403647; https://doi.org/10.1117/12.403647
PROCEEDINGS
10 PAGES


SHARE
Back to Top