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6 March 2001 Adhesives deliver low-shrink low-stress bonds and fast UV cure
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Proceedings Volume 4198, Optomechanical Engineering 2000; (2001) https://doi.org/10.1117/12.417332
Event: Intelligent Systems and Smart Manufacturing, 2000, Boston, MA, United States
Abstract
Lower stress, higher quality assemblies as well as quantum increases in productivity are now possible with `new generation', light curing adhesives. This new technology makes obsolete the industry-accepted assumption that low strain requires slow curing UV adhesives, epoxies and cements. Curing in only seconds and without the need for secondary thermal cure, these new light curing adhesives produce laminates which are essentially strain-free, and edge bonds with shrinkage as low as 0.2%. This paper will compare and contrast these new adhesives with existing bonding technologies in typical applications. Included are comparison between epoxies, UV curing mercaptoesters, and the new light curing Aerobic Acrylates, as well as the incorporation of adhesives into optical component design.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kyle T. Rhodes "Adhesives deliver low-shrink low-stress bonds and fast UV cure", Proc. SPIE 4198, Optomechanical Engineering 2000, (6 March 2001); https://doi.org/10.1117/12.417332
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