PROCEEDINGS VOLUME 4226
INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS AND ASSEMBLY | 27 NOVEMBER - 2 DECEMBER 2000
Microlithographic Techniques in Integrated Circuit Fabrication II
INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS AND ASSEMBLY
27 November - 2 December 2000
Singapore, Singapore
Additional Paper from EUROPTO 1999 Conference on Lithography for Semiconductor Manufacturing
Proc. SPIE 4226, Measurement and analysis of reticle and wafer level contributions to total CD variation, 0000 (20 October 2000); https://doi.org/10.1117/12.404840
Optical Lithographic Systems and Metrology Techniques
Proc. SPIE 4226, Low-k1 imaging: how low can we go?, 0000 (20 October 2000); https://doi.org/10.1117/12.404849
Proc. SPIE 4226, Progress of excimer laser technologies, 0000 (20 October 2000); https://doi.org/10.1117/12.404855
Proc. SPIE 4226, 200/300-mm Micrascan IV 248-nm system for high-throughput and tight CD control applications, 0000 (20 October 2000); https://doi.org/10.1117/12.404856
X-Ray, E-Beam, and Ion Beam Lithography
Proc. SPIE 4226, New 2D to 3D x-ray lithography technology for grayscale structures, 0000 (20 October 2000); https://doi.org/10.1117/12.404857
Proc. SPIE 4226, Ion projection lithography: November 2000 status and sub-70-nm prospects, 0000 (20 October 2000); https://doi.org/10.1117/12.404858
Proc. SPIE 4226, Low-voltage e-beam irradiation: a new tool for microlithography technology, 0000 (20 October 2000); https://doi.org/10.1117/12.404859
Proc. SPIE 4226, Fabrication of diffractive micro-optical lens for integration with optoelectronic devices by direct laser writing, 0000 (20 October 2000); https://doi.org/10.1117/12.404841
Proc. SPIE 4226, Overview of reticle enhancement technology software strategy, 0000 (20 October 2000); https://doi.org/10.1117/12.404842
Resist Processing Issues
Proc. SPIE 4226, Corner rounding and line-end shortening in optical lithography, 0000 (20 October 2000); https://doi.org/10.1117/12.404843
Proc. SPIE 4226, Hardmask/BARC materials for 157-nm lithography, 0000 (20 October 2000); https://doi.org/10.1117/12.404844
Proc. SPIE 4226, Effect of electrostatic field on photoresist coating uniformity, 0000 (20 October 2000); https://doi.org/10.1117/12.404845
Proc. SPIE 4226, Minimum-time optimal feedforward control of conductive heating systems for microelectronics processing of silicon wafers and quartz photomasks, 0000 (20 October 2000); https://doi.org/10.1117/12.404846
Proc. SPIE 4226, Investigation of process latitude in e-beam lithography for positive CAR UVIII using novel volumetric linewidth measurement, 0000 (20 October 2000); https://doi.org/10.1117/12.404847
Proc. SPIE 4226, Patternable hybrid sol-gel glass, 0000 (20 October 2000); https://doi.org/10.1117/12.404848
Poster Session
Proc. SPIE 4226, Simulation of resolution enhancement in contact lithography by off-axis illumination, 0000 (20 October 2000); https://doi.org/10.1117/12.404850
Proc. SPIE 4226, New event-based methodology to improve photolithography productivity, 0000 (20 October 2000); https://doi.org/10.1117/12.404851
Proc. SPIE 4226, Dense plasma focus radiation source for microlithography and micromachining, 0000 (20 October 2000); https://doi.org/10.1117/12.404852
Proc. SPIE 4226, Optimization of the planarizing performance of a DUV organic bottom antireflective coating for via first dual-damascene process: cooperation to achieve material and process characterization, 0000 (20 October 2000); https://doi.org/10.1117/12.404853
Section
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