Paper
24 October 2000 Design considerations in micromachined silicon microphones
Jianmin Miao, Rongming Lin, Longqing Chen, Quanbo Zou, Sin Yee Lim, Suan Hee Seah
Author Affiliations +
Proceedings Volume 4228, Design, Modeling, and Simulation in Microelectronics; (2000) https://doi.org/10.1117/12.405427
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore
Abstract
We present and compare the different design of micromachined silicon condenser microphones. The aim is to develop the microphones with high sensitivity and low fabrication cost. Slotted and corrugated diaphragms have been designed and fabricated in order to increase the mechanical sensitivity of microphones. At the same time we developed the fabrication process for the low stress so stress-free multilayers polysilicon used as the microphone diaphragms. To increase the microphone chip density on one wafer and avoid the sticking problem during the wet release process, a new process design using deep reactive ion etching is prosed, such process system is available in our laboratory.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jianmin Miao, Rongming Lin, Longqing Chen, Quanbo Zou, Sin Yee Lim, and Suan Hee Seah "Design considerations in micromachined silicon microphones", Proc. SPIE 4228, Design, Modeling, and Simulation in Microelectronics, (24 October 2000); https://doi.org/10.1117/12.405427
Lens.org Logo
CITATIONS
Cited by 1 scholarly publication.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Silicon

Annealing

Etching

Reactive ion etching

Semiconducting wafers

Crystals

Doping

Back to Top