24 October 2000 From MEMS to the global simulation of SoCs
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Proceedings Volume 4228, Design, Modeling, and Simulation in Microelectronics; (2000) https://doi.org/10.1117/12.405418
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore
Abstract
This paper is dealing with design, simulation and test of microsystems. Both existing tools and open research areas are addressed. All through the paper, similarities between the present development of MEMS and the development of microelectronics decades ago are pointed out, including the migration from point tools to Computer-Aided Design frameworks, testing, foundries/fabless business or IP issues. Specific aspects such as thermal simulation of microstructures and thermomechanical design at the package level. The conclusion is depicting a possible global simulation scheme integrating thermomechanical design at the package level. The conclusion is depicting a possible global simulation scheme integrating the needs of Systems on Chip multi language simulation together with the needs of MEMS multipurpose simulation.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Marta Rencz, Vladimir Szekely, Andras Poppe, Bernard Courtois, "From MEMS to the global simulation of SoCs", Proc. SPIE 4228, Design, Modeling, and Simulation in Microelectronics, (24 October 2000); doi: 10.1117/12.405418; https://doi.org/10.1117/12.405418
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