Translator Disclaimer
23 October 2000 Chemical imaging of microvias in flip chip pin grid array packages using time-of-flight secondary ion mass spectroscopy
Author Affiliations +
Proceedings Volume 4229, Microelectronic Yield, Reliability, and Advanced Packaging; (2000) https://doi.org/10.1117/12.404875
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore
Abstract
Distribution of chemical species in cross sectioned micro- via were observed using the Time-of-Flight-Secondary-Ion- Mass-Spectroscopy (TOF-SIMS). The TOF-SIMS combines high molecular and elemental detection sensitivities and good lateral resolution for detection of molecular and elemental content in the micro-via and surrounding structures of the flip-chip-pin-grid array packages fabricated from several sources. The data obtained indicate that it is feasible to compare and monitor organic package fabrication processes using TOF-SIMS chemical images.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yoon Loong Khong and Hooi Ling Lee "Chemical imaging of microvias in flip chip pin grid array packages using time-of-flight secondary ion mass spectroscopy", Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); https://doi.org/10.1117/12.404875
PROCEEDINGS
8 PAGES


SHARE
Advertisement
Advertisement
Back to Top