23 October 2000 Comprehensive study of indium-implantation-induced damages in 0.25-um MOSFETs
Author Affiliations +
Proceedings Volume 4229, Microelectronic Yield, Reliability, and Advanced Packaging; (2000) https://doi.org/10.1117/12.404863
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore
In this paper, an investigation of the DC characteristics of 0.25 micrometers indium-implanted MOSFETs concerning on indium implantation induced damages is presented. The experimental data indicates that the devices with indium-implanted channel tend to show increases in device leakage current, which could be attributed the indium implantation induced damages. The impact of the indium implantation on the degradation of device performance was investigated through detailed studies of device I-V characteristics, and the measurement results are found to correlate well with the variations in the process conditions. Our findings indicate that the elimination of the implantation-induced damages by post implantation annealing is particularly important for deep sub-micron MOSFETs using indium implantation.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hong Liao, Hong Liao, Louis Lim, Louis Lim, Anthony Lowrie, Anthony Lowrie, Chock Hing Gan, Chock Hing Gan, Mark Redford, Mark Redford, } "Comprehensive study of indium-implantation-induced damages in 0.25-um MOSFETs", Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); doi: 10.1117/12.404863; https://doi.org/10.1117/12.404863

Back to Top