Finite element analysis and experiments of ultrafine-pitch wire bonding

Zhaowei Zhong; Kay Soon Goh

doi:10.1117/12.404885

23 October 2000 Finite element analysis and experiments of ultrafine-pitch wire bonding

Zhaowei Zhong, Kay Soon Goh

Proceedings Volume 4229, Microelectronic Yield, Reliability, and Advanced Packaging; (2000) https://doi.org/10.1117/12.404885
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore

Abstract

The demand for increased computing power and more complex IC devices with increased functions per chip results in higher I/O count packaging. With the shrinkage in IC size and the decrease in pad pitch, the trend is moving from the current fine-pitch, such as the 50micrometers and 40micrometers . Given the tight constraint, the bonding process and bonding tool design become more complex, which produces smaller bond deformation in a repeatable manner. Those problems associated with open wire, bond liftoff, surface contamination, etc., have now become more sensitive and difficult to control.

Citation Download Citation

Zhaowei Zhong and Kay Soon Goh "Finite element analysis and experiments of ultrafine-pitch wire bonding", Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); https://doi.org/10.1117/12.404885

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