23 October 2000 Finite element analysis and experiments of ultrafine-pitch wire bonding
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Proceedings Volume 4229, Microelectronic Yield, Reliability, and Advanced Packaging; (2000); doi: 10.1117/12.404885
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore
Abstract
The demand for increased computing power and more complex IC devices with increased functions per chip results in higher I/O count packaging. With the shrinkage in IC size and the decrease in pad pitch, the trend is moving from the current fine-pitch, such as the 50micrometers and 40micrometers . Given the tight constraint, the bonding process and bonding tool design become more complex, which produces smaller bond deformation in a repeatable manner. Those problems associated with open wire, bond liftoff, surface contamination, etc., have now become more sensitive and difficult to control.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhaowei Zhong, Kay Soon Goh, "Finite element analysis and experiments of ultrafine-pitch wire bonding", Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); doi: 10.1117/12.404885; https://doi.org/10.1117/12.404885
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KEYWORDS
Capillaries

Finite element methods

Gold

Model-based design

Tolerancing

Transducers

Ultrasonics

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