23 October 2000 Projecting wafer probe yields for products fabricated in new technologies
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Proceedings Volume 4229, Microelectronic Yield, Reliability, and Advanced Packaging; (2000) https://doi.org/10.1117/12.404861
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore
Abstract
It is desirable to be able to forecast wafer probe yields for new products to be fabricated using the next generation technology. This is advantageous to assess the cost effectiveness of developing new technologies as well as to be able to plan wafer starts for these products.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ron Ross, Ron Ross, Nick Atchison, Nick Atchison, "Projecting wafer probe yields for products fabricated in new technologies", Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); doi: 10.1117/12.404861; https://doi.org/10.1117/12.404861
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