Simulation of novel microassembly using shape memory alloy

Weiming Huang; Xiangyang Gao

doi:10.1117/12.420848

21 March 2001 Simulation of novel microassembly using shape memory alloy

Weiming Huang, Xiangyang Gao

Author Affiliations +

Proceedings Volume 4235, Smart Structures and Devices; (2001) https://doi.org/10.1117/12.420848
Event: Smart Materials and MEMS, 2000, Melbourne, Australia

Abstract

In this paper, a novel micro assembly method using Shape Memory Alloy (SMA) is investigated. The principle of this method and its advantages are briefly discussed. A finite element package, ANSYS, is used to simulate the whole assembly process. A special material element is used for modeling the behavior of SMA.

Citation Download Citation

Weiming Huang and Xiangyang Gao "Simulation of novel microassembly using shape memory alloy", Proc. SPIE 4235, Smart Structures and Devices, (21 March 2001); https://doi.org/10.1117/12.420848

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