16 March 2001 Micromachined components for terahertz circuits and systems
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Proceedings Volume 4236, Smart Electronics and MEMS II; (2001); doi: 10.1117/12.418751
Event: Smart Materials and MEMS, 2000, Melbourne, Australia
This paper discusses the need for micromachined components in very high frequency (terahertz) electronic circuits. It is shown that, with the use of micromachining, conventional rectangular rectangular technology can be scaled down to the dimensions required for these high frequency circuits. Furthermore, the fabrication techniques are capable of producing the high quality surface necessary for low loss components. Fabrication processes are presented together with the results of electrical characterisation.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert E. Miles, David Paul Steenson, J. Martyn Chamberlain, "Micromachined components for terahertz circuits and systems", Proc. SPIE 4236, Smart Electronics and MEMS II, (16 March 2001); doi: 10.1117/12.418751; https://doi.org/10.1117/12.418751

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