16 March 2001 Micromachined submillimeter-wave frequency multipliers
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Abstract
The work described here uses microfabrication methods to integrate semiconductor devices with micromachined waveguide cavities to form submillimetre-wave frequency multipliers. Processing schemes involve both planar and three-dimensional lithography, using conventional photoresist and epoxy based SU8. Two approaches have been used. In the first, micromachining methods were employed to fabricate an integrated 270-810GHz frequency tripler. This includes a varactor diode contacted via an electroplated whisker, which is integrated with a stripline filter and waveguide probe. In the second approach, a specially designed Schottky diode chip incorporating the stripline filter/bias circuit is mounted in a micromachined, waveguide circuit block to form a 135-270GHz frequency doubler.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James G. Partridge, James G. Partridge, Steven R. Davies, Steven R. Davies, } "Micromachined submillimeter-wave frequency multipliers", Proc. SPIE 4236, Smart Electronics and MEMS II, (16 March 2001); doi: 10.1117/12.418755; https://doi.org/10.1117/12.418755
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