29 June 2001 Fabrication of 3D interconnected network of microchannels inside silica by femtosecond irradiation and etching
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Abstract
We present, to the best of our knowledge, first demonstration of a direct three-dimensional (3D) microfabrication in the volume of silica glass. The microfabrication was carried out in two steps: 1) recording 3D patterns inside silica glass via silica damaging by focused femtosecond laser pulses (in multishot regime), and sample translation along X, Y, and Z directions; 2) etching the recorded patterns in HF based etchants. Comparative study of chemical etch rates in diluted HF, buffered HF, and a mixture of HF, H2O and HNO3 (P etch) reveals direct evidence of structural and/or stoichiometrical difference between damaged and fresh silica. 3D structures consisting of submicrometer size voxels (smallest optically damaged volume element per shot) were successfully fabricated in the silica glass. The presented technique allows fabrication of 3D channels as narrow as 10 micrometers inside silica, with arbitrary angle of interconnection and high aspect ratio (10 micrometers diameter channels in a 100 micrometers thick silica slab). This approach allows to speed up fabrication, and the resulting 3D structures are optically transparent, which is advantageous for optical characterization (transmission, photoluminescence, Raman scattering, etc.) with spatial resolutions determined by focusing optics.
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Andrius Marcinkevicius, Andrius Marcinkevicius, Saulius Juodkazis, Saulius Juodkazis, Vygantas Mizeikis, Vygantas Mizeikis, Mitsuru Watanabe, Mitsuru Watanabe, Shigeki Matsuo, Shigeki Matsuo, Junji Nishii, Junji Nishii, Hiroaki Misawa, Hiroaki Misawa, } "Fabrication of 3D interconnected network of microchannels inside silica by femtosecond irradiation and etching", Proc. SPIE 4274, Laser Applications in Microelectronic and Optoelectronic Manufacturing VI, (29 June 2001); doi: 10.1117/12.432543; https://doi.org/10.1117/12.432543
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