29 June 2001 Laser direct writing of copper on polyimide, FR4, and Al203 substrates from solid metalorganic film
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Abstract
Laser induced copper deposition from solid copper formate precursor films has been studied on polyimide, FR4 and Al2O3 substrates. Unlike most work reported in the literatures, we used 532 nm Nd:YAG laser beam instead of CW Ar+ laser for the process. A writing speed of 10 mm/s was achieved for deposition of micron-thick copper lines with a typical electrical resistivity of around 85 (mu) ohm-cm. To further increase the electrical conductivity and copper thickness, selective electroless copper plating was performed on the laser processed sample. This has reduced the electrical resistivity of the copper line to below 5 (mu) ohm-cm that is about 3 times the value of bulk copper (1.673 (mu) ohm-cm). A typical copper thickness exceeding 10 micrometers has been achieved after the electroless plating process. The surface morphology and chemical composition were analyzed by using SEM and EDS. The copper line was found to adhere well to the substrate. Besides circuit repair and customization, the reported technique is potentially useful for rapid prototyping of PCB circuits.
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Xincai Wang, HongYu Zheng, Gnian Cher Lim, "Laser direct writing of copper on polyimide, FR4, and Al203 substrates from solid metalorganic film", Proc. SPIE 4274, Laser Applications in Microelectronic and Optoelectronic Manufacturing VI, (29 June 2001); doi: 10.1117/12.432533; https://doi.org/10.1117/12.432533
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