29 June 2001 Microcomponents manufacturing for precise devices by copper vapor laser
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This paper presents investigation results of drilling of metal microcomponents by copper vapor laser. The laser consists of master oscillator - spatial filter - amplifier system, electronics switching with digital control of laser pulse repetition rate and quantity of pulses, x-y stage with computer control system. Mass of metal, removed by one laser pulse, is measured and defined by means of diameter and depth of holes. Interaction of next pulses on drilled material is discussed. The difference between light absorption and metal evaporation processes is considered for drilling and cutting. Efficiency of drilling is estimated by ratio of evaporation heat and used laser energy. Maximum efficiency of steel cutting is calculated with experimental data of drilling. Applications of copper vapor laser for manufacturing is illustrated by such microcomponents as pin guide plate for printers, stents for cardio surgery, encoded disks for security systems and multiple slit masks for spectrophotometers.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sergey Gorny, Sergey Gorny, Michail O. Nikonchuk, Michail O. Nikonchuk, Igor V. Polyakov, Igor V. Polyakov, } "Microcomponents manufacturing for precise devices by copper vapor laser", Proc. SPIE 4274, Laser Applications in Microelectronic and Optoelectronic Manufacturing VI, (29 June 2001); doi: 10.1117/12.432525; https://doi.org/10.1117/12.432525


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