15 May 2001 Application of microsandblast machining to LiNbO3 wafer surface for broadband modulators
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Proceedings Volume 4277, Integrated Optics Devices V; (2001) https://doi.org/10.1117/12.426815
Event: Symposium on Integrated Optics, 2001, San Jose, CA, United States
Abstract
Machining technology for LiNbO3 (LN) wafer surface aiming a mass-production of broadband LN modulators is investigated. Although several manufacturers commercially supply 40G LN modulators, there are many difficulties in mass-production of such broadband LN modulators. For instance, in order to realize sufficiently broadened bandwidth performance, machining of LN wafer surfaces is necessary as demonstrated by ridge-waveguide modulators and devices using very-thin substrates. We focus the study on the machining technology of LN wafers applicable to mass- production based on micro-sandblast techniques. In order to demonstrate effectiveness of the micro-sandblast, 40G LN modulators designed to have a partially thinned substrate along RF-electrodes are experimentally fabricated.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Futoshi Yamamoto, Futoshi Yamamoto, Yuji Yamane, Yuji Yamane, Naoki Mitsugi, Naoki Mitsugi, Masataka Yokosawa, Masataka Yokosawa, Hirotoshi Nagata, Hirotoshi Nagata, "Application of microsandblast machining to LiNbO3 wafer surface for broadband modulators", Proc. SPIE 4277, Integrated Optics Devices V, (15 May 2001); doi: 10.1117/12.426815; https://doi.org/10.1117/12.426815
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