Translator Disclaimer
23 April 2001 Advanced Technology Program: investing in new ideas, new technologies, and new markets
Author Affiliations +
The Advanced Technology Program (ATP), an agency within the U.S. Department of Commerce's Technology Administration and the National Institute of Standards and Technology, provides co-funding to industry for highrisk/ high-payoff applied research. Companies of any size may apply, and universities or governmental research institutions may partner with industry in ATP projects. Since its inception, the ATP has participated in 468 projects, representing $3B of total industry/government investment. U.S. industry has indicated that ATP has a significant role to play in the area of high throughput R&D. ATP can catalyze the development of lower-cost hardware and software tools to bring leading-edge, generic technologies to more industries, and can facilitate the integration of hardware and software systems. The ATP is currently funding research projects in high throughput discovery of catalysts and polymer coatings, with FY199 project requests of $36. I M over five years. In addition to extramural funding, the ATP has internal funding of the NIST Measurement and Standards Laboratories (MSL). The MSL opportunity in high throughput screening is to develop measurement science to support new parallel methodologies and measurement tools tailored to specific industrial needs; to validate new and existing measurement methods and models using parallel or high throughput approaches; and to demonstrate application of HT methods to new materials and R&D problems; and to develop new standards addressing systems integration issues. The ATP is co-funding research at the NJST MSL in key areas.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John D. Hewes "Advanced Technology Program: investing in new ideas, new technologies, and new markets", Proc. SPIE 4281, Combinatorial and Composition Spread Techniques in Materials and Device Development II, (23 April 2001);

Back to Top