15 May 2001 MOEMS: technology, packaging, and optical interconnection
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The development of optical MEMS or MOEMS devices is strongly driven by the requirements of high date transfer in telecommunications and data transmission. To realize the required high data rates with low loss, EMV-sensitivity, cross-talk, and reflections optical MEMS devices were developed. In this paper a short overview on the technological and commercial visions on these fields is given. Furthermore the most important technological approaches to make optical MEMS are summarized and some devices are mentioned. But in order to realize complete devices the packaging and interconnection requirements have to be early incorporated into the design process. This is pointed out and some packaging approaches are discussed. Moreover the important field of optical interconnections is illuminated and a very promising way to integrate polymer waveguides into a PCB is presented.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Henning Schroeder, Henning Schroeder, W. Scheel, W. Scheel, } "MOEMS: technology, packaging, and optical interconnection", Proc. SPIE 4284, Functional Integration of Opto-Electro-Mechanical Devices and Systems, (15 May 2001); doi: 10.1117/12.426864; https://doi.org/10.1117/12.426864


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