15 May 2001 P-type InGaAsP coolers for integrated optic devices
Author Affiliations +
Abstract
Single stage thin film coolers based on thermoelectric and thermionic cooling in p-type InGaAsP superlattice structures have been fabricated. Devices with different sizes and at various ambient temperatures have been characterized. Experimental results showed 0.5 degree centigrade cooling below the ambient temperature at 25C. This cooling over 1 4mu2m thick superlattice barrier corresponds to cooling power densities on the order of 200 W/cm2. The device cools by a factor of two better at higher temperatures (70C). This is due to the reduction of the superlattice thermal conductivity and the broadening of the electronic distribution function at higher temperatures. 150x150 micrometers 2 devices provide largest cooling at room temperature while the optimum device size shrinks as the temperature increases. Simulations results that take into account finite thermal resistance of the InP substrate, the effect of the contact resistance, heat generation in the wire-bonds and metallic pads on top of the device predict accurately the optimum cooling of these micro refrigerators. By eliminating the major parasitic sources of heating (Joule heating in the substrate, heat conduction through the side contact and reducing the contact resistance to 5x7-7 ohm-cm2) simulations show that, ultimately, one can achieve 15 degree(s)C cooling (10's of kW/cm2 cooling power) with single stage p-InGaAsP thin film coolers.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Daryoosh Vashaee, Christopher J. LaBounty, Xiaofeng Fang, Gehong Zeng, Patrick Abraham, John Edward Bowers, Ali Shakouri, "P-type InGaAsP coolers for integrated optic devices", Proc. SPIE 4284, Functional Integration of Opto-Electro-Mechanical Devices and Systems, (15 May 2001); doi: 10.1117/12.426867; https://doi.org/10.1117/12.426867
PROCEEDINGS
6 PAGES


SHARE
Back to Top