16 May 2001 Integration possibilities with MOEMS/MEMS devices and packaging technologies using a MEMS simulation tool
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Proceedings Volume 4290, Optoelectronic Integrated Circuits and Packaging V; (2001) https://doi.org/10.1117/12.426908
Event: Symposium on Integrated Optics, 2001, San Jose, CA, United States
Abstract
This paper reports on monolithic integration possibilities between a novel micromachined packaging technology and MEMS/MOEMS devices. A high-density lead connection scheme is tailored to fulfill the needs of emerging high density optoelectromechanical/microelectromechanical devices. The packaging structure employs double polysilicon as device and package fabrication and anodic bonding as the sealing technology. Thermal stresses arising due to sealing temperatures have been investigated for various device dimensions. The advantages of the micromachined lead transfer and packaging scheme has been explored and it is indicated that it can incorporate both surface and also bulk micromachined devices as post or intermediate processing steps.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mehmet Dokmeci, Mehmet Dokmeci, Gregory A. Kirkos, Gregory A. Kirkos, } "Integration possibilities with MOEMS/MEMS devices and packaging technologies using a MEMS simulation tool", Proc. SPIE 4290, Optoelectronic Integrated Circuits and Packaging V, (16 May 2001); doi: 10.1117/12.426908; https://doi.org/10.1117/12.426908
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