Paper
30 May 2001 Free-space optical interconnection of 3D optoelectronic VLSI chip stacks
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Abstract
Large-scale computer and data-communication systems have reached a bottleneck in performance in recent years due to the limitations of electronic interconnections for data transfer. One potential solution is based on the use of optoelectronic device arrays for free space optical interconnects. In this paper, we present the design and implementation of a 16 X 16 3D distributed optoelectronic crossbar switch.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dawei Huang, Emel Yuceturk, Guoqiang Li, Mark M. Wang, Xuezhe Zheng, Philippe J. Marchand, Sadik C. Esener, Yue Liu, and Volkan H. Ozguz "Free-space optical interconnection of 3D optoelectronic VLSI chip stacks", Proc. SPIE 4292, Optoelectronic Interconnects VIII, (30 May 2001); https://doi.org/10.1117/12.428019
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KEYWORDS
Optoelectronics

Switches

Optical interconnects

Very large scale integration

Microlens

Mirrors

Computing systems

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