13 June 2001 Stress analysis of mixed-mode crack of homogeneous and dissimilar materials by speckle photography
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Proceedings Volume 4317, Second International Conference on Experimental Mechanics; (2001) https://doi.org/10.1117/12.429589
Event: Second International Conference on Experimental Mechanics, 2000, Singapore, Singapore
Abstract
The point by point measurement of in-plane displacement was conducted by the point wide filtering approach of speckle photography. The experiment was conducted on the compact normal and shear specimen made of homogeneous and dissimilar material subjected to various kinds of mixed-mode loading. Then, stress-intensity factors of asymptotic solution derived by Sun and Jih were estimated using the displacement data obtained from speckle photography by the least squares method. The contour diagrams of stress and strain obtained by using the raw displacement data of experiment remarkably differed from those obtained by the finite element analysis (FEA). However, the stress and strain obtained by the present analyzing system were very similar to those obtained by FEA.
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Kenji Machida, Kenji Machida, T. Hirano, T. Hirano, H. Okamura, H. Okamura, } "Stress analysis of mixed-mode crack of homogeneous and dissimilar materials by speckle photography", Proc. SPIE 4317, Second International Conference on Experimental Mechanics, (13 June 2001); doi: 10.1117/12.429589; https://doi.org/10.1117/12.429589
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