16 August 2001 MEMS pressure belt with sensor interface and communication architecture
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Boeing utilizes many different sensor types and their associated electronic systems for aircraft testing. An array of sensors are being used to determine the load on the wings of an aircraft. We have developed a MEMS sensor network, which takes advantage of this technology. In this paper, we report the development of a 'pressure belt' containing a electronic packaging configuration incorporating MEMS pressure sensors and multi-chip modules. A thin profile of less than 0.070 inch was required for aerodynamic reasons. The MCM substrate was fabricated on oxidized silicon using copper as the conductor and photo-sensitive polyimide as the dielectric material. Direct-chip-attachment (flip chip) process was used to bond the MEMS device to the module and the bus connection was conducted through embedded copper on a flex PCB to the host computer. An encapsulation material for the protection of the bare electronic components was selected for improving the reliability of the module. Improvements in the signal conditioning and processing are being incorporated into the pressure belt. The design includes a signal conditioning unit that includes analog to digital conversion, a digital filter, temperature compensation and conversion to engineering units.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lee H. Eccles, Lee H. Eccles, Wayne Catlin, Wayne Catlin, Mark J. Holland, Mark J. Holland, Namsoo P. Kim, Namsoo P. Kim, Larry Malchodi, Larry Malchodi, } "MEMS pressure belt with sensor interface and communication architecture", Proc. SPIE 4334, Smart Structures and Materials 2001: Smart Electronics and MEMS, (16 August 2001); doi: 10.1117/12.436615; https://doi.org/10.1117/12.436615


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