Evaluation of Shipley XP2040D positive chemically amplified resist for SCALPEL mask fabrication

Bing Lu; Zorian S. Masnyj; Pawitter J. S. Mangat; Kevin J. Nordquist; Eric S. Ainley; Douglas J. Resnick

doi:10.1117/12.436703

20 August 2001 Evaluation of Shipley XP2040D positive chemically amplified resist for SCALPEL mask fabrication

Bing Lu, Zorian S. Masnyj, Pawitter J. S. Mangat, Kevin J. Nordquist, Eric S. Ainley, Douglas J. Resnick

Proceedings Volume 4343, Emerging Lithographic Technologies V; (2001) https://doi.org/10.1117/12.436703
Event: 26th Annual International Symposium on Microlithography, 2001, Santa Clara, CA, United States

Abstract

The Semiconductor Industry Association (SIA) has placed stringent requirements on Next Generation Lithography mask critical dimension (CD) control. A new chemically amplified (CA) positive resist, Shipley XP2040D was evaluated for mask making application. This resist exhibited an extraordinary post exposure bake (PEB) sensitivity, less than 0.6 nm/ degree(s)C, along with a sub-50 nm resolution. The PEB stability in ambient was larger than 4.5 hours and the line-edge-roughness (LER) was less than 2.9 nm.

Citation Download Citation

Bing Lu, Zorian S. Masnyj, Pawitter J. S. Mangat, Kevin J. Nordquist, Eric S. Ainley, and Douglas J. Resnick "Evaluation of Shipley XP2040D positive chemically amplified resist for SCALPEL mask fabrication", Proc. SPIE 4343, Emerging Lithographic Technologies V, (20 August 2001); https://doi.org/10.1117/12.436703

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