20 August 2001 Insertion of EUVL into high-volume manufacturing
Author Affiliations +
EUV Lithography has become the leading and perhaps only, candidate for extension of semiconductor lithography into the sub-50nm realm. This paper reviews the requirements for high volume, semiconductor lithography and examines the capability of EUVL to meet those challenges. The current state of EUVL technology is reviewed and the remaining challenges for insertion of EUVL into manufacturing are discussed.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peter J. Silverman, Peter J. Silverman, } "Insertion of EUVL into high-volume manufacturing", Proc. SPIE 4343, Emerging Lithographic Technologies V, (20 August 2001); doi: 10.1117/12.436631; https://doi.org/10.1117/12.436631

Back to Top