Progress of the EUVL alpha tool

Hans Meiling; Jos P.H. Benschop; Udo Dinger; Peter Kuerz

doi:10.1117/12.436675

20 August 2001 Progress of the EUVL alpha tool

Hans Meiling, Jos P.H. Benschop, Udo Dinger, Peter Kuerz

Proceedings Volume 4343, Emerging Lithographic Technologies V; (2001) https://doi.org/10.1117/12.436675
Event: 26th Annual International Symposium on Microlithography, 2001, Santa Clara, CA, United States

Abstract

After the successful completion of the European program EUCLIDES in which core competence for Extreme UltraViolet Lithography (EUVL) technology was generated, ASML (system integration), Carl Zeiss (optics), and their partners have entered the next phase of the program: design and realization of an exposure tool called the alpha tool ((alpha) -tool). This tool should be completed in 2003, and will demonstrate 50-nm-node compliant imaging using full- field all-reflective four-times reducing optics, as well as high performance vacuum scanning wafer- and reticle stages. IN this paper we present the status of the project, as well as highlight the progress in the optics development and optics contamination mitigation efforts.

Citation Download Citation

Hans Meiling, Jos P.H. Benschop, Udo Dinger, and Peter Kuerz "Progress of the EUVL alpha tool", Proc. SPIE 4343, Emerging Lithographic Technologies V, (20 August 2001); https://doi.org/10.1117/12.436675

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available