Paper
22 August 2001 Control of resist flow process for sub-0.15-μm small contact hole by latent image
Byung-Kap Kim, Suk-Joo Lee, Dae-Yup Lee, Jeong-Woo Lee, Jeong-Lim Nam
Author Affiliations +
Abstract
Bake process of photo resist above glass transition temperature (Tg) increases its fluidity and shrinks contact holes patterned on the wafer. This process enables us to define sub-0.2 micrometers contact hole pattern with KrF, which is one of major issues of sub-0.15 micrometers device technology. However, the amount of PR flow depends on the contact hole size, pattern density and environment, which makes it difficult to control the fine critical dimension (CD) variation. In this paper, new approach to overcome the difficulties is studied with acetal type PR and attenuated phase shift mask (att. PSM). It is found that the change of chemical bonding in PR by light exposure decreases the resist flow sensitivity, which makes us solve the problems. The att. PSM enables us to control the aerial image intensity between contact holes, and the CD variation induced by bake process was drastically decreased when it is compared to Cr mask. The layout optimization by simulation for aerial image control in bulk region, and the resist flow process combined with att. PSM allows us to control the CD variation less than 20 nm for the sub-0.15 micrometers devices fabrication.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Byung-Kap Kim, Suk-Joo Lee, Dae-Yup Lee, Jeong-Woo Lee, and Jeong-Lim Nam "Control of resist flow process for sub-0.15-μm small contact hole by latent image", Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, (22 August 2001); https://doi.org/10.1117/12.436755
Lens.org Logo
CITATIONS
Cited by 3 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Image processing

Photomasks

Chromium

Radiofrequency ablation

Photoresist processing

Critical dimension metrology

Phase shifts

RELATED CONTENT

Photomask etch challenges for future technology nodes
Proceedings of SPIE (May 19 2006)
Mask CD correction method using dry-etch process
Proceedings of SPIE (October 20 2006)
Quality control of embedded-type phase-shift mask
Proceedings of SPIE (July 03 1995)
Actual use of phase-shift mask
Proceedings of SPIE (December 08 1995)

Back to Top