22 August 2001 Haidinger interferometer for silicon wafer TTV measurement
Author Affiliations +
We describe a novel, IR phase shifting Haidinger fringe interferometer for measuring the thickness, total thickness variation (TTV) and bow of silicon wafers. We show that by taking 3 interferograms of the wafer in different positions in the cavity it is possible to separate thickness, TTV and bow. We also show that bow has an effect on the measurement of TTV.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert E. Parks, Robert E. Parks, Lianzhen Shao, Lianzhen Shao, Angela D. Davies, Angela D. Davies, Christopher J. Evans, Christopher J. Evans, } "Haidinger interferometer for silicon wafer TTV measurement", Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, (22 August 2001); doi: 10.1117/12.436775; https://doi.org/10.1117/12.436775

Back to Top