22 August 2001 W-CMP alignment using ASML's ATHENA system on an I-line stepper
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Abstract
This paper demonstrates the overlay capability of ASML's ATHENA alignment system on I-line steppers for W-CMP processes. The evaluation presents the method used to find the best scribe-line marks, alignment recipe and the long term overlay capability of ATHENA for a 0.35micrometers device in a production environment. This alignment capability for W-CMP meets the overlay requirement for the 0.35micrometers process and thus leads to device yield improvement.
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K. John Prasad, K. John Prasad, D. Arunagiri Rajan, D. Arunagiri Rajan, Yew-Kong Tan, Yew-Kong Tan, Gin Ping Sun, Gin Ping Sun, Stephen Morgan, Stephen Morgan, Merritt Phillips, Merritt Phillips, Bruce Ng, Bruce Ng, "W-CMP alignment using ASML's ATHENA system on an I-line stepper", Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, (22 August 2001); doi: 10.1117/12.436730; https://doi.org/10.1117/12.436730
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