Negative-tone cycloolefin photoresist for 193-nm lithography

ShihChi Fu; Kuo-Huang Hsieh; Lon A. Wang

doi:10.1117/12.436906

24 August 2001 Negative-tone cycloolefin photoresist for 193-nm lithography

ShihChi Fu, Kuo-Huang Hsieh, Lon A. Wang

Proceedings Volume 4345, Advances in Resist Technology and Processing XVIII; (2001) https://doi.org/10.1117/12.436906
Event: 26th Annual International Symposium on Microlithography, 2001, Santa Clara, CA, United States

Abstract

The chemistry of acid-catalyzed dehydration reaction and followed by crosslinking of the tert-alcohol group in the cycloolefin photoresists was used to tailor the performance of the photoresists for 193nm lithography. A radiation- sensitive photoacid generator (PAG) in this chemically amplified photoresist (CAMP) can change the polarity of the exposed area of the resist and exhibit a negative-tone behavior. The cycloolefin resists are synthesized by the free radical copolymerization of alicyclic monomer and maleic anhydride, and/or by the cationic polymerization of alicyclic monomer via Pd catalyst followed by the attaching of tert-alcohol group in to the resist. The side reaction of cycloolefin copolymer was observed at the temperature below the post exposure baking (PEB) temperature, but this problem can be eliminated by the introduction of isobornyl methacrylate into the polymer. The lithographic performance of the resists was investigated by using isopropyl alcohol as a developer under various processing conditions. The results demonstrate that these resists are the promising candidates for being used in 193nm lithography.

Citation Download Citation

ShihChi Fu, Kuo-Huang Hsieh, and Lon A. Wang "Negative-tone cycloolefin photoresist for 193-nm lithography", Proc. SPIE 4345, Advances in Resist Technology and Processing XVIII, (24 August 2001); https://doi.org/10.1117/12.436906

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