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24 August 2001 New polymer for 157-nm single-layer resist based on fluorine-containing acryl copolymer
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We are reporting on the development of acryl polymer based on novel methacrylate and acrylate monomers with various trifluoromethyl groups for the application to 157nm chemically amplified positive-tone resists. The (alpha) - trifluoromethylation of the alkyl ester in methacrylate or acrylate could employ the reduction of acrylpolymer absorbance at 157nm by spectra analysis with the VUV-200 spectrophotometer by JASCO. Although the trifluoromethyl groups could employ the reduction of base polymer absorbance at 157nm, the homopolymers have issued weak etch resistance as a photoresist base polymer. To take account of this issue, we have developed a novel monomer, trifluoromethyl- iso-adamantylmethacrylate (TFIAdMA) and a new co-polymer system with the combination of fluorinated methacrylate derivatives and substituted p-hydroxystyrene. The absorption coefficient of poly(p-tert-butoxystyren-co- hexafluoro-tert-butyl methacrylate-co-methacrylic acid) incicated to be less than 3 micrometers -1 at 157nm. Patterning results were obtained with a 157nm contact exposure system of VUVES-4500 by LTJ. One of the experimental resists, based on a particular polymer ratio and photo acid generator, has clearly achieved 180nm line and space pattern resolution. At 140nm resist film thickness, the sensitivity was 31 mJ/cm2 when using 0,26N tetrametylammonium hydroxide surfactant type developer.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Toshiyuki Ogata, Koutaro Endo, Hiroshi Komano, and Toshimasa Nakayama "New polymer for 157-nm single-layer resist based on fluorine-containing acryl copolymer", Proc. SPIE 4345, Advances in Resist Technology and Processing XVIII, (24 August 2001);

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