Advances in OPC
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ArF lithography for printing 100-nm gates on low-volume ASIC devices: CD budget issues related to various binary mask-making processes
Application of full-chip level optical proximity correction to memory device with sub-0.10-μm design rule and ArF lithography
Novel multiple resist patterning stacks for dual-damascene interconnection and resolution-enhanced patterns
Application of 3D EMF simulation for development and optimization of alternating phase-shifting masks
Measurement of transmittance variation of projection lenses depending on the light paths using a grating-pinhole mask
Mutually optimizing resolution enhancement techniques: illumination, APSM, assist feature OPC, and gray bars