14 September 2001 Introduction of new techniques for matching overlay enhancement
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Proceedings Volume 4346, Optical Microlithography XIV; (2001); doi: 10.1117/12.435702
Event: 26th Annual International Symposium on Microlithography, 2001, Santa Clara, CA, United States
Abstract
This paper discusses two new techniques that have been developed to improve overlay matching accuracy over multiple wafer scanners: Super Distortion Matching system (SDM) and Grid Compensation for Matching (GCM), and actual data from experiments performed using the techniques. Overlay matching errors can be divided into the two basic categories, intra-shot error and inter-shot error, which can be improved by SDM and GCM, respectively.
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Takahisa Kikuchi, Yuuki Ishii, Noriaki Tokuda, "Introduction of new techniques for matching overlay enhancement", Proc. SPIE 4346, Optical Microlithography XIV, (14 September 2001); doi: 10.1117/12.435702; https://doi.org/10.1117/12.435702
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KEYWORDS
Semiconducting wafers

Distortion

Overlay metrology

Actuators

Optical alignment

Scanners

Error analysis

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