Translator Disclaimer
14 September 2001 Optimizing style options for subresolution assist features
Author Affiliations +
Sub-resolution assist features (SRAF) have been shown to provide significant process window enhancement and across chip line-width variation reduction when used in conjunction with modified illumination lithography. Work previously presented at this conference has focused on the optimization of sraf design rules that specify the predominantly one dimensional placement and width of assist features as a function of layout pitch. This paper will recount the optimization of SRAF style options that specify how SRAF are to behave in realistic two dimensional circuit layouts. Based on the work done to strike the correct balance between sraf manufacturability, CAD turnaround time, and lithographic benefit in IBM's early product implementation exercises, the evolution of sraf style options is presented. Using simulation as well as exposure data, this paper explores the effect of various two dimensional sraf layout solutions and demonstrates the use of model based verification in the optimization of sraf style options.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lars W. Liebmann, James A. Bruce, William Chu, Michael Cross, Ioana C. Graur, Joshua J. Krueger, William C. Leipold, Scott M. Mansfield, Anne E. McGuire, and Dianne L. Sundling "Optimizing style options for subresolution assist features", Proc. SPIE 4346, Optical Microlithography XIV, (14 September 2001);


Selective process aware OPC for memory device
Proceedings of SPIE (October 30 2007)
Controlling defocus impact on OPC performance
Proceedings of SPIE (August 28 2003)
MEEF-based mask inspection
Proceedings of SPIE (December 06 2004)

Back to Top