14 September 2001 SVG 157-nm lithography technical review
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SVG Lithography (SVGL) has established and is executing a comprehensive program for the development of an advanced 157 nm Lithography Exposure System capable of processing 70 nm critical dimensions for three years now. This paper presents the approach, and details the present state of the challenges in the development of 157 nm lithography. It also describes the SVGL 157 nm program approach and provides some insight into the progress made to date addressing the challenges. Specific attention is paid to addressing 3 critical areas: Molecular contamination/purging, optical coating, and optical surfacing.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas J. Fahey, Thomas J. Fahey, James A. McClay, James A. McClay, Matthew E. Hansen, Matthew E. Hansen, Bruce A. Tirri, Bruce A. Tirri, Matthew Lipson, Matthew Lipson, "SVG 157-nm lithography technical review", Proc. SPIE 4346, Optical Microlithography XIV, (14 September 2001); doi: 10.1117/12.435789; https://doi.org/10.1117/12.435789


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