Strategies for wafer-scale hot embossing lithography

Hella-Christin Scheer; Hubert Schulz; D. Lyebyedyev

doi:10.1117/12.425080

9 April 2001 Strategies for wafer-scale hot embossing lithography

Hella-Christin Scheer, Hubert Schulz, D. Lyebyedyev

Proceedings Volume 4349, 17th European Conference on Mask Technology for Integrated Circuits and Microcomponents; (2001) https://doi.org/10.1117/12.425080
Event: 17th European Conference on Mask Technology for Integrated Circuits and Microcomponents, 2000, Munich, Germany

Abstract

We summarize flow and filling effects detected during hot embossing lithography (HEL), which reflect the visco-elastic properties of the polymers as well as the specific processing conditions and stamp pattern configurations. In particular a delayed elastic recovery is reported, which is found in larger elevated stamp regions. The consequences of these effects for mask definition by HEL are discussed, and strategies for wafer-scale imprint are de-duced. Successful imprint of 4' wafer is demonstrated under adequate processing conditions.

Citation Download Citation

Hella-Christin Scheer, Hubert Schulz, and D. Lyebyedyev "Strategies for wafer-scale hot embossing lithography", Proc. SPIE 4349, 17th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (9 April 2001); https://doi.org/10.1117/12.425080

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