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10 October 2001 HDVIP FPA technology at DRS Infrared Technologies
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Abstract
The HgCdTe high-density vertically integrated photodiode (HDVIPTM) concept developed at DRS Infrared Technologies is described. This technology is currently in production in both large-area scanning and staring focal plane array (FPA) formats. Detector models are presented and compared to performance data from scanning and staring FPAs. Performance data from 256 X 256 and 640 X 480 LWIR and MWIR staring FPAs, in keeping with these models, is presented with responsivity and D* operabilities in excess of 99.9%. Third generation system requirements mandate megapixel FPA operation at high temperatures, with multi-color capability, and high frame rates. To this end operation of 640 X 480 MWIR HgCdTe FPAs has been demonstrated at temperatures in excess of 150 K, and the push to these higher operating temperatures, with its effect on system cost, is discussed. The technology has also been extended into the realm of simultaneous two-color detection with large area formats, and this effort is described.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael A. Kinch "HDVIP FPA technology at DRS Infrared Technologies", Proc. SPIE 4369, Infrared Technology and Applications XXVII, (10 October 2001); https://doi.org/10.1117/12.445316
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