10 October 2001 ICC silicon microbolometer development program
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Abstract
Infrared Components Corporation (ICC) recently announced that the company had acquired rights to uncooled microbolometer technology developed at the Defence Science and Technology Organization (DSTO), Australia. Under the license agreement DSTO is developing a technology transfer package for implementation in a silicon MEMS foundry. ICC has contracted Electro-optic Sensor Design (EOSD) for FPA design and analysis and local co-ordination of the technology transfer program. ICC has also entered into an agreement with SUNY Albany Center for Advanced Thin Film Technology (ACATFT) to transition the DSTO technology to production. In this paper we outline the microbolometer processing technology and discuss the aims and objectives of the ICC program.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kevin Charles Liddiard, Kevin Charles Liddiard, Jonathan P. Knauth, Jonathan P. Knauth, Steven M. Balick, Steven M. Balick, Bai Xu, Bai Xu, Nigel Robinson, Nigel Robinson, } "ICC silicon microbolometer development program", Proc. SPIE 4369, Infrared Technology and Applications XXVII, (10 October 2001); doi: 10.1117/12.445298; https://doi.org/10.1117/12.445298
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