19 September 2001 Three-Dimensional Imaging Sensors program
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This paper gives an overview of Lockheed Martin's effort as part the DARPA Three Dimensional Imaging Sensors Program. The overall system, the detector technology, the ROIC approaches, and the system model are discussed. The system approach has a laser transmitter that illuminates the entire sensor field-of-view (FOV) with a single laser pulse and collects the returned energy on a focal plane array (FPA) where each picture element (pixel) measures range. The detector is a short wavelength infrared HgCdTe APD array based on DRS Infrared Technology's well established architecture of HDVIP.. The ROICs implement 'on-chip' pixel level signal processing to generate 3-D imagery. The model is used to make predictions based on range, power, aperture, weather and FPA characteristics to help forecast expected device/readout/system performance.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mark K. Browder, Mark K. Browder, Bruno Evans, Bruno Evans, Jeffrey D. Beck, Jeffrey D. Beck, Michael A. Blessinger, Michael A. Blessinger, Wolfram S. Blattner, Wolfram S. Blattner, Richard LeBlanc, Richard LeBlanc, Brian H. Miles, Brian H. Miles, } "Three-Dimensional Imaging Sensors program", Proc. SPIE 4377, Laser Radar Technology and Applications VI, (19 September 2001); doi: 10.1117/12.440127; https://doi.org/10.1117/12.440127


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