18 October 2001 Coupling paths in multilayer printed circuit boards for electromagnetic interference and immunity: experiments and FDTD modeling
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Abstract
Electromagnetic emissions from electronics associated with explosives is a potential detection modality, both passive listening, and stimulated RF emissions. However, the parasitic paths by which energy is coupled off a printed circuit board from an active device, and by which external energy can be coupled onto the board and to a device, must be identified and characterized. One such noise-coupling path is identified in this work, and a modeling approach demonstrated. In particular, coupling of noise from the DC power bus of a multilayer printed circuit board that uses entire metal layers for power and ground, and an I/O line that transitions through the DC power planes is investigated.
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Wei Cui, Daniel P. Berg, James L. Drewniak, Richard E. DuBroff, "Coupling paths in multilayer printed circuit boards for electromagnetic interference and immunity: experiments and FDTD modeling", Proc. SPIE 4394, Detection and Remediation Technologies for Mines and Minelike Targets VI, (18 October 2001); doi: 10.1117/12.445464; https://doi.org/10.1117/12.445464
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