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STIL II: photoresist silylation simulation using 2D finite element analysis and boundary movement algorithms
Novel analysis technique for examining the effect of exposure conditions on the mask error enhancement factor
Manufacturing considerations for MEEF minimization and process window optimization for 180-nm contact holes
Enhancing the development rate model in optical lithography simulation of ultrathick resist films for applications such as MEMS and LIGA
Electron projection lithography: progress on the electron column modules for SCALPEL high-throughput/alpha exposure tools
Sub-0.35-μm i-line lithography with new advanced bottom antireflective coatings optimized for high-topography and dual-damascene applications