26 April 2001 Simple method for characterizing photoresist dissolution properties
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Proceedings Volume 4404, Lithography for Semiconductor Manufacturing II; (2001) https://doi.org/10.1117/12.425194
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom
Abstract
The lithographic performance of a photoresist process is largely determined by details of the dissolution properties. Numerous methods have been used to obtain this information but most fall into two major categories: 1) a traditional dissolution rate monitor (DRM) which measures film thickness versus time for multiple exposure doses, and 2) 'Poor man's DRM' which deduces dissolution rates from measured film loss as a function of dose for several different development times. The traditional DRM method has several disadvantages including the relative complexity of the equipment. The Poor man's approach, while convenient, has difficulty with very high and very low dissolution rates, and cannot easily distinguish surface dissolution form bulk dissolution. This paper shows results with a simple approach based on off-line analysis of videotape of a developing wafer. This video DRM method offers several advantages including portability and low cost. The results are not strongly influenced by process variables involving experimental geometry, developer volume, or the immediate environment. The camera can view small areas and therefore the method appears to be applicable to micro stepper exposures. A detailed analysis of a 248nm process is given but the method is also applied to 193nm and 157nm resist processes at different locations.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Steven G. Hansen, Steven G. Hansen, Youri van Dommelen, Youri van Dommelen, } "Simple method for characterizing photoresist dissolution properties", Proc. SPIE 4404, Lithography for Semiconductor Manufacturing II, (26 April 2001); doi: 10.1117/12.425194; https://doi.org/10.1117/12.425194
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