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23 April 2001 Microlaminography for high-resolution BGA and flip-chip inspection
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Abstract
X-ray laminography is a method that allows getting local depth information from big flat objects like PCBs and electronic assemblies. The few X-ray laminography systems recently introduced on the market cannot reach the spatial resolution that is necessary for inspection of modern electronic assemblies. According to the needs in high-resolution inspections for electronic industry a digital X-ray microlaminography system has been developed on the base of multilayer tomosynthesis approach. This instrument is based on the new x-ray geometry with minimum moving parts. It can reach a spatial resolution of several microns in plane and in depth and visualize layer-by-layer area of 5 X 5 mm at any place in an object up to several hundreds mm in size. Typical scanning time is 20 seconds for 20 layers and 90 seconds for 100 layers. The software package includes the system control and multilayer tomosynthesys (layer-by-layer separation) during acquisition, as well as a three-dimensional rendering program for realistic visualization of the object's microstructure. The main application areas are BGA inspection, Flip-Chips, multilayer PCBs, micromechanics (watch, etc.).
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alexander Sasov "Microlaminography for high-resolution BGA and flip-chip inspection", Proc. SPIE 4406, In-Line Characterization, Yield, Reliability, and Failure Analysis in Microelectronic Manufacturing II, (23 April 2001); https://doi.org/10.1117/12.425259
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